| Sn |
tin |
| T/C |
thermocompression |
| Ta |
tantalum |
| TAB |
Technical Advisory Board; tape automated bonding |
| TAP |
Tool Application Program |
| TAS |
trace analysis system |
| TASC |
Technical Analysis Service for CoO |
| TAT |
turnaround time |
| TBAH |
tetrabutylammonium hydroxide |
| TC |
time constant; temperature coefficient; thermocouple |
| TCA |
test calibration assembly; 1 |
| TCAD |
technology computer-aided design |
| TCC |
tactical cell controller |
| TCE |
temperature coefficient of expansion |
| TCM |
tunneling current microscopy |
| TCP |
transformer-coupled plasma; tape carrier package |
| TCP/IP |
transmission control protocol/Internet protocol |
| TCR |
temperature coefficient of resistance |
| TD |
thermal desorption |
| TDDB |
time-dependent dielectric breakdown |
| TDEAT |
tetrakis (diethylamino) titanium |
| TDLAS |
tunable diode laser absorption spectroscopy |
| TDMAT |
tetrakis (dimethylamido) titanium |
| TDMS |
thermal desorption mass spectrometry |
| TDS |
thermal desorption spectroscopy |
| Te |
tellurium |
| TE |
transverse electric; transmitted electron |
| TEA |
transverse excited atmosphere |
| TEC |
thermal expansion coefficient; test and electrical characterization |
| TECAP |
transistor electrical characterization and analysis program |
| TED |
transient enhanced diffusion; transmitted electron detection |
| TEG |
technical exchange group |
| TEM |
transmission electron microscopy; transverse electromagnetic |
| TEOS |
tetraethylorthosilicate; tetrethoxysilicide |
| TFC |
total fault coverage |
| TFE |
tetrafluorethylene |
| TFT |
thin-film transistor |
| TG |
thermogravimetry |
| TGA |
thermal gas analysis; thermal gravimetric analysis |
| THC |
total hydrocarbons |
| Ti |
titanium |
| TIBA |
triisobutlaluminum |
| TIR |
total indicator runout; total internal reflection |
| TIS |
tool-induced shift |
| Tl |
thallium |
| TLC |
thin layer chromatography |
| TLE |
tool loading elevator |
| TLI |
thin layer imaging |
| TLM |
tape-laying machine; telemeter; transition line model |
| TLV |
threshold limit value |
| TLV/TWA |
threshold limit value/time-weighted average |
| TM |
transport module |
| TMA |
thermal mechanical analyzer |
| TMB |
trimethylborate |
| TMC |
transport module controller; transfer module controller |
| TMP |
trimethylphosphate; turbomolecular pump |
| TO |
transistor outline package |
| TOA |
take-off angle |
| TOC |
total organic carbon; total oxidizable carbon |
| TOF |
time-of-flight |
| TPD |
temperature program desorption |
| TPG |
test pattern generation |
| TPM |
total productive maintenance; total productive manufacturing |
| TPRS |
temperature programmed reaction spectroscopy |
| TPU |
thermal processing unit |
| TQM |
total quality management |
| TSCA |
Toxic Substances Control Act |
| TSI |
top surface imaging |
| TSOP |
thin small outline package |
| TSP |
temperature-sensitive parameter |
| TT |
technology transfer |
| TTL |
transistor-transistor logic |
| TTV |
total thickness variation |
| TVS |
triangular voltage sweep |
| TWA |
time-weighted average |
| TWG |
Technical Working Group |
| TXRF |
total X-ray fluorescence |
| W |
tungsten |
